LUBBOCK, TX — The Edward E. Whitacre Jr. College of Engineering at Texas Tech University has been awarded $3.75 million from the Defense Advanced Research Projects Agency (DARPA) and the State of Texas to create a new Master of Science in Electrical Engineering program.
According to a press release, this program is designed to meet growing national needs in semiconductor innovation. The program will focus on 3D Heterogeneous Integration (3DHI), which involves vertically stacking miniature semiconductor components into compact systems with exceptional performance. 3DHI is set to revolutionize how electronic systems are designed and manufactured.
The new program is part of Texas Tech’s partnership with the Texas Institute for Electronics (TIE), a statewide push to keep Texas at the forefront of the semiconductor industry. Students in the program will take specialized courses in areas like semiconductor fabrication, 3D integration, and materials science. Students will also have access to brand-new labs, internship placements, and mentoring from industry professionals, says Texas Tech.
“The goal of this program is to develop a new generation of engineers who are prepared to lead the next wave of semiconductor innovation,” said Tim Dallas, the Principal Investigator and Professor of Electrical and Computer Engineering.
“By combining strong technical education with hands-on experience and industry collaboration, we are positioning our graduates to immediately impact the design and manufacturing of 3DHI devices.”
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